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CMCC MoCu Alloy Copper Molybdenum Alloy Material Copper Molybdenum Copper Copper Alloy Cu/MoCu/Cu Alloy Heat Sink Sheet
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xProduct Details
| Name | CMCC Cu/MoCu/Cu Alloy Copper Molybdenum Copper Alloy Material | Material | Cu/MoCu/Cu Alloy |
|---|---|---|---|
| Type | Cu-MoCu-Cu141,Cu-MoCu-Cu232,Cu-MoCu-Cu111,Cu-MoCu-Cu212, | Density | 9.5g/cm3, |
| Size | As Per Customer's Drawing | Applictaion | Heat Sink Material |
| High Light | custom Copper Molybdenum Alloy,Copper Molybdenum Alloy Material,MoCu Alloy |
||
Product Description
Copper -Molybdenum -Copper Alloy Material, CMCC Cu/MoCu/Cu
1.CMCC Cu/MoCu/Cu Alloy Copper -Molybdenum Copper -Copper Alloy description:
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure, which consists of two sublayers - copper (Cu) wrapping a core layer - molybdenum copper alloy (MoCu), which is in the X region Compared with tungsten-copper, molybdenum-copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
2. Parameter of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper-Copper Alloy:
|
Grade |
Content (Cu:Mo70Cu:Cu) |
Density (g/cm3) |
Thermal conductivity (W/M.K) | Thermal expansion coefficient (10-6/k) |
Tensile strength (Mpa) |
|
Cu-MoCu-Cu141 |
1:4:1 |
9.5 |
|
7.3-10.0-8.5 |
|
|
Cu-MoCu-Cu232 |
2:3:2 |
9.3 |
|
7.3-11.0-9.0 |
|
|
Cu-MoCu-Cu111 |
1:1:1 |
9.2 |
|
|
|
|
Cu-MoCu-Cu212 |
2:1:2 |
9.1 |
|
|
|
3. Feature of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper -Copper Alloy:
1). The performance and use of this product are similar to that of copper, molybdenum and copper. The core material is usually Mo70Cu30, and Mo50Cu50 can also be used. The thermal expansion coefficient of copper molybdenum copper copper is adjustable. Copper-Molybdenum Copper-Copper has different coefficients of thermal expansion in the X and Y directions and has a higher thermal conductivity than tungsten-copper, molybdenum-copper and CMC. Cu-MoCu-Cu can also be stamped.
2). During operation, power electronics and circuits produce a lot of heat. The heat sink material helps to dissipate heat from the chip, transfer it to other media, and maintain stable operation of the chip.
3). It has a thermal expansion coefficient and high thermal conductivity matching with different substrates; excellent high temperature stability and uniformity; excellent processing performance;
4). Higher thermal conductivity than CMC.
5). Can be punched into parts to reduce costs.
6). The interface is firmly bonded and can withstand repeated high temperature shocks at 850°C
7). The thermal expansion coefficient can be designed to match with materials such as semiconductors and ceramics.
8). Non-magnetic.
4. Applictaion of CMCC Cu/MoCu/Cu Alloy Copper- Molybdenum Copper -Copper Alloy:
The coefficient of expansion and thermal conductivity of copper-molybdenum-copper-copper can be designed for RF, microwave and semiconductor high-power devices.
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