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Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30 Electrical And Thermal Conductivity Heat Sink Material
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xProduct Details
| Name | Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30 | Material | Molybdenum Copper Alloy |
|---|---|---|---|
| Mo Content | 70% | Cu Content | 30% |
| Diameter | 15mm | Length | 100~300mm |
| Surface | Bright | MOQ | 1kg |
| High Light | 15mm Molybdenum Copper,MoCu30 Molybdenum Copper,Molybdenum Heat Sink Rod |
||
Product Description
Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30
1. Description of Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30:
Molybdenum copper alloy is a composite material of molybdenum and copper, its properties are similar to tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. Similar to the material of tungsten copper (WuCu) heat sink material, the thermal expansion coefficient of customized different molybdenum copper (MoCu) heat sink material (molybdenum copper sheet) can also be obtained by adjusting the composition ratio of molybdenum, because molybdenum copper (MoCu) heat sink The material is much lighter than the tungsten copper (WuCu) heat sink material, Because molybdenum copper has a far lower density than tungsten copper, it is more suited for usage in the aircraft industry and other industries. High purity, uniformity of structure, and superior performance characterize the product. Since the Mo-Cu material used does not add any binder, the material has a high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials used in the electronic sector, with cost reductions achieved through Mo-Cu stamping, mass production, and high-performance machining. Compared with molybdenum, molybdenum-copper material is more resistant to ablation, has more plasticity and machinability, and can be used as high-temperature components for rockets and missiles that use slightly lower temperatures, and can also replace molybdenum as a component in other weapons. High electrical and thermal conductivity materials are necessary for conductive and heat-dissipating components in high-power integrated circuits and microwave integrated devices, while also taking vacuum performance, heat resistance, and thermal expansion coefficient into mind. Molybdenum copper is the favored material since its qualities satisfy these specifications.
2. Parameter of Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30:
| Grade | Chemical Content | Performance | ||||
| Density | Thermal expansion coefficient ppm/K |
Thermal conductivity W/m.K |
||||
| Alloy material | content | Mass density g/cm3 |
Relative density %T.D. |
|||
| Mo70Cu30 | Mo Cu |
70±1 balance |
9.7 | ≥99 | 7.6~7.8 | 190~200 |
| Mo60Cu40 | Mo Cu |
60±1 balance |
9.6 | ≥99 | 8.3~8.5 | 200~220 |
| Mo50Cu50 | Mo Cu |
50±1 balance |
9.5 | ≥99 | 9.7~9.9 | 220~250 |
3. Surface quality and Size of Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30:
The surface of the molybdenum-copper alloy heat sink rod is turned without defects such as holes, cracks, delaminations or inclusions. The defects and allowable deviations of the molybdenum-copper alloy rods are in accordance with the following table.
|
Diameter
|
Length
|
||
|
diameter range
|
tolerance
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Length range
|
tolerance
|
|
10<Φ≤25
|
+/-0.5
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100<Φ≤200
|
+/-5
|
Other size according to customer request.
4.Applictaion of Diameter 15mm Molybdenum Copper Alloy Heat Sink Rod MoCu30:
• Power amplifier heat dissipation material
• Radio base stations
• For high and medium voltage switches or circuit breakers, arc and vacuum contacts
• Heat sinks used in electronic equipment
• Electrodes for resistance welding
• Electronic packaging and heat sink materials
• IGBT modules for electric vehicle engines (EV/HEV)
• High performance lead frame
• Thermal control boards and heat sinks for thermal control devices, etc.
WCu alloy rod WCu alloy plate for electrode
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