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High Temperature MoLa Molybdenum Ribbon For Electronic Components Molybdenum Foil Moly Sheet
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xProduct Details
| Name | High Temperature Molybdenum MoLa Molybdenum Ribbon For Electronic Components | Material | Molybdenum Alloy |
|---|---|---|---|
| Grade | MoLa | Density | 10.2g/cm3 |
| Thickness | 0.03mm | Width | 20~300mm |
| Surface | Bright | Standard | ASTM B386 |
| High Light | MoLa Molybdenum Ribbon,High Temperature Molybdenum Ribbon,Bright Electronic Molybdenum Products |
||
Product Description
High Temperature Molybdenum MoLa Molybdenum Ribbon For Electronic Components
1. Description Of High Temperature Molybdenum MoLa Ribbon For Electronic Components:
The processing of molybdenum ribbon is mainly to obtain the corresponding mechanical properties. Its main processing processes include bending, spinning, stretching, punching, etc., so that it can be used under high temperature and low temperature conditions, and its properties are roughly the same as molybdenum plates. Molybdenum ribbon is widely used in electronics, electrical components, drawn products, furnace insulation and corrosion-resistant products.
2. Product parameters Of High Temperature Molybdenum MoLa Ribbon For Electronic Components:
Molybdenum ribbon
Grade:361, 364,Mo1, TZM, MLa
Standard: ASTM B386
Purity: Pure Mo ≥99.95%,MoLa≥99.0%
Density: 10.2g/cm3
Melting Point:2610℃
Surface:Cold rolled bright
Size: min.0.025mm
Feature:High melting point (2610℃), small thermal expansion, high thermal conductivity, good corrosion resistance to molten metal and glass, etc.
3. Delivery Condition Of High Temperature Molybdenum MoLa Ribbon For Electronic Components:
Generally, the thickness of molybdenum ribbon is between 0.01 and 0.03. The 0.025 molybdenum ribbon prepared by our company has low temperature resistance, continuous surface, flat edge, good surface texture, high clamping force, high strength, low cost and high efficiency Etc.
The surface of the product is a smooth metallic color, without cracks, folds, peeling, penetrating pinholes, metal or non-metallic indentation defects, local slight scratches and roll marks, and traces of lubricating oil and cleaning are allowed . The surface of the annealed product will be slightly scratched and wrinkled.
4. Chemical Content Of High Temperature Molybdenum MoLa Ribbon For Electronic Components:
| Grade | Mo | Impurity content, not more than | |||||||||
| Al | Ca | Fe | Mg | Ni | Si | C | N | O | La2O3 | ||
| Mo1 | Remain | 0.002 | 0.002 | 0.010 | 0.002 | 0.005 | 0.01 | 0.01 | 0.003 | 0.008 | - |
| Mo2 | Remain | 0.005 | 0.004 | 0.015 | 0.005 | 0.005 | 0.01 | 0.02 | 0.003 | 0.020 | - |
| MoLa | Remain | 0.002 | 0.002 | 0.015 | 0.005 | 0.005 | 0.01 | 0.02 | 0.005 | - | 0.1~1.8 |
| Note: The O content of MoLa grades can be tested according to customer needs | |||||||||||
5. Package Of High Temperature Molybdenum MoLa Ribbon For Electronic Components:
Molybdenum ribbon is generally delivered in rolls, wrapped with soft paper or plastic film on the mandrel. Molybdenum ribbon that are not delivered in rolls are wrapped with soft paper or plastic film per layer, and each stack is clamped and tied with cardboard, and then packed in cartons. In the carton, place moisture-proof paper lined, and fill it with foam or soft paper and plug it tightly to prevent the items from moving. In addition, on the outside of the carton, the words moisture-proof, handle with care, etc. should be indicated.
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