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Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal
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xProduct Details
| Name | Molybdenum Sheet For Semiconductor | Material | Molybdenum And Molybdenum Alloy |
|---|---|---|---|
| Grade | Mo1,TZM,MoLa Alloy | Density | 10.2g/cm3 |
| Shape | Round Sheet | Application | Semiconductors |
| High Light | Molybdenum TZM Sheets,Semiconductor TZM Sheets,custom Molybdenum Sheet |
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Product Description
Molybdenum Sheet For Semiconductor
1. Description Of Molybdenum Sheet For Semiconductor:
High purity, high density, fine, and uniform grain characteristics are present in molybdenum sputtering targets, resulting in extremely high sputtering efficiency, uniform film thickness, and a smooth etching surface during the sputtering process.
Molybdenum sheet for semiconductors has excellent mechanical properties, low expansion, high thermal conductivity, and extremely high electrical conductivity at high temperatures. It is a refractory metal with a variety of uses.
There are many different combinations of molybdenum that can be used as a sputtering target, including pure molybdenum, molybdenum titanium, molybdenum tantalum, and molybdenum alloy targets. High purity, high density, fine, and consistent grain properties are present in molybdenum sputtering targets, resulting in extremely high sputtering efficiency, homogeneous film thickness, and a clean etching surface throughout the sputtering process. Molybdenum sheet made to a customer's specifications for semiconductors.
2. Parameter Of Molybdenum Sheet For Semiconductor:
| Name | Molybdenum Sheet For Semiconductor |
| Molecular Weight | 95.94 |
| Appearance | Silvery |
| Melting Point | 2623 °C |
| Boiling Point | 4639 °C |
| Density | 10280 kg/m3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 5.2 microhm-cm @ 0 °C |
| Electronegativity | 1.9 Paulings |
| Heat of Fusion | 6.6 Cal/gm mole |
| Heat of Vaporization | 128 K-Cal/gm atom at 4612 °C |
| Poisson's Ratio | 0.31 |
| Specific Heat | 0.0599 Cal/g/K @ 25 °C |
| Tensile Strength | N/A |
| Thermal Conductivity | 1.38 W/cm/K @ 298.2 K |
| Thermal Expansion | (25 °C) 4.8 µm·m-1·K-1 |
| Vickers Hardness | 1530 MPa |
| Young's Modulus | 329 GPa |
3. Products Show Of Molybdenum Sheet For Semiconductor:
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