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PVD Coating Tantalum Sputtering Target For Semiconductor Coating And Optical Coating
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xProduct Details
| Name | PVD Coating Tantalum Target | Grade | Ta1 Ta2 RO5200 RO5400 RO5252 RO5255 |
|---|---|---|---|
| Purity | ≥99.95% | Density | 16.68g/cm3 |
| Surface | Machined Surface | Standard | ASTM B708 |
| Delivery Status | Annealed | Shape | Flat Target Rotating Target Special-shaped Customization |
| High Light | Optical Coating Tantalum Target,PVD Coating Tantalum Sputtering Target,Semiconductor Coating Tantalum Sputtering Target |
||
Product Description
Product Information:
| Name | PVD coating tantalum target |
| Grade | Ta1 Ta2 RO5200 RO5400 RO5252 RO5255 |
| Purity | ≥99.95% |
| Density | 16.68g/cm3 |
| Surface | Machined surface, no pits, scratches, stains, burrs and other defects |
| Standard | ASTM B708 |
| Shape | Flat target, Rotating target ,Special-shaped customization |
Chemical Content of PVD Coating Tantalum Target:
| Grade | Main elements | Impurity content less than % | |||||||||||
| Ta | Nb | Fe | Si | Ni | W | Mo | Ti | Nb | O | C | H | N | |
| Ta1 | Remain | —— | 0.005 | 0.005 | 0.002 | 0.01 | 0.01 | 0.002 | 0.04 | 0.02 | 0.01 | 0.0015 | 0.01 |
| Ta2 | Remain | —— | 0.03 | 0.02 | 0.005 | 0.04 | 0.03 | 0.005 | 0.1 | 0.03 | 0.01 | 0.0015 | 0.01 |
| TaNb3 | Remain | ＜3.5 | 0.03 | 0.03 | 0.005 | 0.04 | 0.03 | 0.005 | —— | 0.03 | 0.01 | 0.0015 | 0.01 |
| TaNb20 | Remain | 17.0～23.0 | 0.03 | 0.03 | 0.005 | 0.04 | 0.03 | 0.005 | —— | 0.03 | 0.01 | 0.0015 | 0.01 |
| Ta2.5W | Remain | 0.005 | 0.005 | 0.002 | 3 | 0.01 | 0.002 | 0.04 | 0.02 | 0.01 | 0.0015 | 0.01 | |
| Ta10W | Remain | 0.005 | 0.005 | 0.002 | 11 | 0.01 | 0.002 | 0.04 | 0.02 | 0.01 | 0.0015 | 0.01 | |
Feature of PVD Tantalum Target:
High melting point,
Low steam pressure,
Good cold working performance,
High chemical stability,
Strong resistance to liquid metal corrosion,
The surface oxide film has a large dielectric constant
Application:
The tantalum target and the copper back target are welded, and then semiconductor or optical sputtering is performed, and the tantalum atoms are deposited on the substrate material in the form of oxides to achieve sputtering coating; tantalum targets are mainly used in semiconductor coating, optical coating and other industries . In the semiconductor industry, metal (Ta) is currently mainly used to coat and form a barrier layer through physical vapor deposition (PVD) as a target material.
We can process according to customer's drawing, and produce Ta rod,plate,wire,foil,crucible etc.
Please send us an inquiry for more information
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