What materials are semiconductors made of? Molybdenum sputtering targets for semiconductors

Today, sputtering targets are used in a wide variety of applications ranging from the semiconductor industry to thin film deposition of various materials in integrated circuit processing. Sputtering is an established technique for depositing thin films of a variety of materials onto substrates of various shapes and sizes. In order to obtain the desired properties in sputter deposited films, the fabrication materials and processes used to fabricate the sputter target are critical. Below we take a look at molybdenum sputtering targets for semiconductors.

In addition to pure metal targets such as tungsten, molybdenum, niobium, titanium, and silicon, there are also alloy targets such as tungsten, molybdenum, titanium, silicon, and tantalum, as well as compounds such as oxides or nitrides. The process of determining the material is as important as the deposition operating parameters that engineers and scientists perfect during the coating process.

Compared with other deposition methods, the sputtered film has better adhesion on the substrate, and materials with extremely high melting points such as molybdenum and tungsten are also easily sputtered. Also, sputtering can be done from top to bottom, while evaporation can only be done from bottom to top.

Sputtering targets are typically round or rectangular, but other shapes are also available, including square and triangular designs. The substrate is the object to be coated, which can include semiconductor wafers, solar cells, optical elements or many other possibilities. The thickness of the coating is typically in the range of angstroms to microns. The membrane can be a single material or multiple materials in a multilayer structure.

As a refractory metal with a wide range of uses, molybdenum has excellent mechanical properties, low expansion, high thermal conductivity and extremely high electrical conductivity at high temperatures. As a sputtering target, there are various combinations, such as pure molybdenum target, molybdenum titanium target, molybdenum tantalum target, molybdenum alloy target (such as TZM plate).

Molybdenum sputtering target has the characteristics of high purity, high density, fine and uniform grains, so as to obtain extremely high sputtering efficiency, uniform film thickness and smooth etching surface during the sputtering process.