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MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material Heat Dissipation Material Mo70Cu30
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xProduct Details
| Name | MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material | Material | Molybdenum Copper Alloy |
|---|---|---|---|
| Grade | MoCu15 | Type | Shaped Parts |
| Size | According To Customer's Drawing | Cu Content | 15% |
| Mo Copper | Remain | MOQ | 1pc |
| Highlight | custom Molybdenum Copper Alloy,Heat Sink Molybdenum Copper Alloy,MoCu Molybdenum Machining Parts |
||
Product Description
MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material
1. MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material Specifications:
The excellent thermal conductivity of molybdenum copper alloy makes it a suitable material for use as a heat sink. The properties of these two alloys are similar, and the density of molybdenum copper alloy is lower than that of tungsten copper alloy. The preparation of molybdenum copper alloy is mainly by dipping method, using high quality molybdenum powder and oxygen free copper powder, and applying isostatic pressing (high temperature sintering copper infiltration), with fine structure, good arc breaking performance, good electrical conductivity and thermal conductivity. Well, there is little thermal expansion.
2. Basic parameters of MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material:
| Grade | Mo content % | Cu content % | Density (g/cm3) | Thermal conductivity (W/M.K) | Thermal expansion coefficient (10-6/K) |
| Mo85Cu15 | 85±1 | Balance | 10 | 160~180 | 6.8 |
| Mo80Cu20 | 80±1 | Balance | 9.9 | 170~190 | 7.7 |
| Mo70Cu30 | 70±1 | Balance | 9.8 | 180~200 | 9.1 |
| Mo60Cu40 | 60±1 | Balance | 9.66 | 210~250 | 10.3 |
| Mo50Cu50 | 50±1 | Balance | 9.54 | 230~270 | 11.5 |
| Mo40Cu60 | 40±1 | Balance | 9.43 | 280~290 | 11.8 |
3. Feature of MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material:
1). Molybdenum copper alloys for electronic packaging (heat sinks), similar to tungsten copper alloys, also have compositional tunability, resulting in adjustable thermal conductivity and thermal expansion coefficient.
2). Compared with tungsten copper alloy, molybdenum copper alloy has lower density but larger thermal expansion coefficient.
3). Heat is produced in large quantities while power electronics and circuits are in use. The heat sink material helps to dissipate heat from the chip, transfer it to other media, and maintain stable operation of the chip.
4). It has the thermal expansion coefficient and high thermal conductivity matching with different substrates; excellent high temperature stability and uniformity; excellent processing performance.
5). Molybdenum copper alloy is a pseudo-alloy composed of two insoluble metals, molybdenum and copper. It has both the characteristics of molybdenum and copper, and has high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, good Vacuum properties, good machinability and special high temperature properties.
6). Compared with tungsten-copper, molybdenum copper alloy has lower density and can be stamped, suitable for super-large batches.
4. Application of MoCu15 Molybdenum Copper Alloy Machining Parts For Heat Sink Material:
Molybdenum copper alloy machining parts can be used for high-power devices such as microwave, laser, radio frequency, and optical communication, high-performance lead frames; thermal control boards and radiators of military and civilian thermal control devices.
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