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3410±20℃ Tungsten Products Target For Vacuum Sputtering Coating Tungsten Target Tungsten Round Plate Target W Plate
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xProduct Details
| Name | Tungsten Target For Vacuum Sputtering Coating | Material | Pure Tungsten |
|---|---|---|---|
| Purity | 99.95% | Density | 19.3 G/cm3 |
| Melting Point | 3410±20℃ | Surface | Polished |
| Size | As Per Customer's Drawing | Standard | ASTM B760 |
| High Light | Polished Tungsten Products,ASTM B760 Tungsten Products,99.95% Tungsten Target |
||
Product Description
Tungsten Target For Vacuum Sputtering Coating
1. Description Of Tungsten Target For Vacuum Sputtering Coating:
What is a tungsten target? It is also known as tungsten sputtering target. It is a product made of pure tungsten powder as raw material. Its appearance is silvery white. It has excellent physical and chemical properties and is very popular in many fields.
Aerospace, rare earth smelting, electric light sources, chemical and medical equipment, metallurgical machinery, smelting equipment, petroleum, and other industries employ tungsten targets primarily.
2. Size And Tolerance Of Tungsten Target For Vacuum Sputtering Coating:
| Item Name | Tungsten Sputtering Target For Magnetron Sputtering Coating |
| Purity | 99.95% |
| Shape | Flat/rotary target, according to your request |
| Available size |
Round: dia 25~300mm, Thickness:<20mm Rectangular: Length up to 1500mm Customization is available |
| Certificates | ISO9001:2008, SGS, The third test report |
| Technics | Hot isostatic pressing |
| Application |
Widely used in coating processing industries A: Electronic and Semiconductor Application. B: Decoration and Coating Application. etc. |
Other size can be processed according to customer's drawing.
Tungsten Sputtering target is produced with a standard anneal
Width Tolerance: +/-1/32”
Length Tolerance: +1/16”, -0”
Surface Finishes: Polished
Standard: ASTM B760
3. Features Of Tungsten Target For Vacuum Sputtering Coating:
1) High purity; the target's purity can typically reach greater than 99.95% after sintering and forging. The higher the target material's purity, in general, the better the coating's electrical qualities and the less probable it is that the related circuit will be shorted out or damaged, provided that other factors remain constant.
2) Direct pressing using powder metallurgy may be done more quickly and at a relatively fair cost, which can save cost by shortening the production cycle.
3) High density; after sintering and forging, the desired density may exceed 19.3g/cm3.
4) The finished target made from ultra-fine pure tungsten powder has a high deflection strength and a generally homogeneous and consistent composition.
5) Excellent thermochemical stability; resistant to volume contraction or expansion, chemical reactions with other compounds, etc.
6) The resistance is low and will not make the circuit generate unnecessary energy.
Additionally, it is non-toxic and non-radioactive, and it has a high melting point, high elasticity, low expansion coefficient, and low vapor pressure.
4.Chemical composition Of Tungsten Target For Vacuum Sputtering Coating:
| Quality Standard (99.95% W) | |||
| Element | Value (<ppm) | Element | Value (<ppm) |
| Fe | 5 | Mo | 10 |
| Ni | 3 | P | 1 |
| Al | 2 | C | 5 |
| Si | 3 | O | 3 |
| Ca | 3 | N | 3 |
| Mg | 2 | ||
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