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Mo70Cu30 / Cu CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated
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xProduct Details
| Name | Cu/Mo70Cu30/Cu CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated | Material | Cu/Mo70Cu30/Cu |
|---|---|---|---|
| Grade | CPC | Shape | Sheet |
| Size | As Per Customer's Drawing | Thickness | 0.2~5mm |
| Application | Heat Sink Material | Heat Sink Coating | Ni/Au、Ni/Au/Ni/Au Etc. |
| Highlight | Molybdenum Copper Alloy Heat Sink Sheet,Nickel Plated Heat Sink Sheet,CPC Heat Spreader Sheet |
||
Product Description
Cu/Mo70Cu30/Cu CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated
1. Information Of CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated:
The "sandwich" construction of CPC makes it a composite material. Copper sheets are used for the upper and lower surfaces, and 70MoCu is used for the middle layer. In order to match the thermal expansion coefficient of ceramic and semiconductor materials and to achieve improved thermal conductivity, the thickness ratio is used.
When compared to CMC, CPC has a lower thermal expansion coefficient and superior thermal conductivity. For the strict standards of electronic packaging, this is highly significant. The product has a matched thermal expansion coefficient and superior heat dissipation performance under the same density settings, which improves the life of the packaged goods.
2. Physical And Chemical Properties Of CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated:
| Grade |
Density g/cm3 |
Thermal expansion coefficient ×10-6 CTE(20℃) |
Thermal Conductivity TC W/(M·K) |
| 111CPC | 9.20 | 8.8 | 380(XY)/330(Z) |
| 121CPC | 9.35 | 8.4 | 360(XY)/320(Z) |
| 131CPC | 9.40 | 7.8 | 350(XY)/310(Z) |
| 141CPC | 9.48 | 7.2 | 340(XY)/300(Z) |
| 1374CPC | 9.54 | 6.7 | 320(XY)/290(Z) |
3. Application Of CPC Molybdenum Copper Alloy Heat Sink Sheet With Nickel Plated:
Electronic packaging is to place an integrated circuit chip with certain functions (including semiconductor integrated circuit chip, thin film integrated circuit substrate, hybrid integrated circuit chip) in a suitable shell container to provide a stable and reliable work for the chip. Environment, protect the chip from or less affected by the external environment, so that the integrated circuit has a stable and normal function. At the same time, packaging is also a means of connecting the output and input terminals of the chip to transition outwards, forming a complete whole together with the chip. Electronic packaging materials are required to have certain mechanical strength, good electrical performance, heat dissipation performance and chemical stability, and different packaging structures and materials are selected according to the type of integrated circuit and the place of use.
Molybdenum copper, tungsten copper, CMC and CMCC materials combine the low thermal expansion rate of molybdenum and tungsten with the high thermal conductivity of copper, which can effectively release the heat of electronic devices and help cool various components such as IGBT modules, RF power amplifiers, and LED chips. Products can be used in large-scale integrated circuits and high-power microwave devices as insulated metal substrates, thermal control boards and heat dissipation components (heat sink materials) and lead frames.
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