• Shaanxi Peakrise Metal Co.,Ltd
    David
    Good company with nice service and high quality and high reputation. One of our reliable supplier , goods are delivered in time and nice package.
  • Shaanxi Peakrise Metal Co.,Ltd
    John Morris
    Material experts, rigorous processing, timely discovery of problems in design drawings and communication with us, thoughtful service, reasonable price and good quality, I believe we will have more cooperation.
  • Shaanxi Peakrise Metal Co.,Ltd
    Jorge
    Thank you for your good after-sales service. Excellent expertise and technical support helped me a lot.
  • Shaanxi Peakrise Metal Co.,Ltd
    Petra
    Through very good communication all problems solved, satisfied with my purchase
  • Shaanxi Peakrise Metal Co.,Ltd
    Adrian Hayter
    The goods purchased this time are very satisfied, the quality is very good, and the surface treatment is very good. I believe we will order the next order soon.
Contact Person : Nicole
Phone Number : 13186382597
Whatsapp : +8613186382597

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT

Place of Origin China
Brand Name PRM
Certification ISO9001
Model Number custom
Minimum Order Quantity 1pc
Price $5~150/pc
Packaging Details Plywood case
Delivery Time 7~10 work days
Payment Terms T/T
Supply Ability 50000pcs/month

Contact me for free samples and coupons.

Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

If you have any concern, we provide 24-hour online help.

x
Product Details
Name Molybdenum Copper Substrate Material Molybdenum Copper Alloy
Size As Per Customer's Drawing Thickness Range 0.1~3mm
Plating Ni Type MoCu/CMC/CPC/CMCC
Thermal Conductivity 140-180 W/(m·K)
High Light

IGBTs Molybdenum Copper Alloy

,

High Thermal Conductivity Molybdenum Copper Alloy

,

3mm Molybdenum Copper Alloy

Leave a Message
Product Description

Molybdenum Copper Substrates For Heat Dissipation

 

1. Information Of Molybdenum Copper Substrates For Heat Dissipation:

 

Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It is a material with excellent thermal conductivity, high electrical connectivity and processability. It is usually prepared by high-temperature hot-pressing process. The bottom of the molybdenum-copper substrate is molybdenum material, and the surface is covered with a layer of high-conductivity copper material. It is usually used as heat dissipation and electrical connectors for power devices IGBT.

 

2. The specifications of molybdenum copper substrate can be customized according to actual needs.

 

Common specifications are as follows:

 

Thickness: 0.1-3.0mm
Size: 30mm x 30mm, 25mm x 15mm, 50mm x 50mm, etc.

 

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 03mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 1

 

3. Performance Parameters Of Molybdenum Copper Substrates For Heat Dissipation:

 

Thermal conductivity: high thermal conductivity, the thermal conductivity is 140-180 W/(m·K).


Electrical Connectivity: Good electrical connectivity that can withstand high current densities and high electron flow rates.


Machinability: Easy to process and braze, enabling complex shapes and high-precision manufacturing.

 

4. Advantage Of Molybdenum Copper Substrates For Heat Dissipation:

 

Excellent heat dissipation: The molybdenum copper substrate has excellent thermal conductivity, which can quickly transfer heat to the radiator, thereby reducing the operating temperature of power devices and improving reliability and stability.


High electrical connectivity: The copper layer can provide good electrical connectivity and can withstand high current density and high electron flow rate, thereby improving the operating efficiency of power devices.


Good machinability: The molybdenum-copper substrate is easy to process and braze, and can realize complex shapes and high-precision manufacturing, which can meet the needs of various power devices.

 

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 23mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 3

 

5. Use Of Molybdenum Copper Substrates For Heat Dissipation:

 

Molybdenum copper substrate is mainly used in heat dissipation and electrical connection of power device IGBT. It can be used in various power electronic equipment, such as frequency converters, AC-DC converters, inverters, etc. At the same time, it is also widely used in aerospace, electronic communication, military and other fields.

 


 

Please click below button for learn more our products.

 

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 4

 

3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT 5