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3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
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xProduct Details
| Name | Molybdenum Copper Substrate | Material | Molybdenum Copper Alloy |
|---|---|---|---|
| Size | As Per Customer's Drawing | Thickness Range | 0.1~3mm |
| Plating | Ni | Type | MoCu/CMC/CPC/CMCC |
| Thermal Conductivity | 140-180 W/(m·K) | ||
| Highlight | IGBTs Molybdenum Copper Alloy,High Thermal Conductivity Molybdenum Copper Alloy,3mm Molybdenum Copper Alloy |
||
Product Description
Molybdenum Copper Substrates For Heat Dissipation
1. Information Of Molybdenum Copper Substrates For Heat Dissipation:
Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It is a material with excellent thermal conductivity, high electrical connectivity and processability. It is usually prepared by high-temperature hot-pressing process. The bottom of the molybdenum-copper substrate is molybdenum material, and the surface is covered with a layer of high-conductivity copper material. It is usually used as heat dissipation and electrical connectors for power devices IGBT.
2. The specifications of molybdenum copper substrate can be customized according to actual needs.
Common specifications are as follows:
Thickness: 0.1-3.0mm
Size: 30mm x 30mm, 25mm x 15mm, 50mm x 50mm, etc.
3. Performance Parameters Of Molybdenum Copper Substrates For Heat Dissipation:
Thermal conductivity: high thermal conductivity, the thermal conductivity is 140-180 W/(m·K).
Electrical Connectivity: Good electrical connectivity that can withstand high current densities and high electron flow rates.
Machinability: Easy to process and braze, enabling complex shapes and high-precision manufacturing.
4. Advantage Of Molybdenum Copper Substrates For Heat Dissipation:
Excellent heat dissipation: The molybdenum copper substrate has excellent thermal conductivity, which can quickly transfer heat to the radiator, thereby reducing the operating temperature of power devices and improving reliability and stability.
High electrical connectivity: The copper layer can provide good electrical connectivity and can withstand high current density and high electron flow rate, thereby improving the operating efficiency of power devices.
Good machinability: The molybdenum-copper substrate is easy to process and braze, and can realize complex shapes and high-precision manufacturing, which can meet the needs of various power devices.
5. Use Of Molybdenum Copper Substrates For Heat Dissipation:
Molybdenum copper substrate is mainly used in heat dissipation and electrical connection of power device IGBT. It can be used in various power electronic equipment, such as frequency converters, AC-DC converters, inverters, etc. At the same time, it is also widely used in aerospace, electronic communication, military and other fields.
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